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Flexible Electronics News

American Semiconductor

Revolutionary Chip Scale Packaging Enabling Reliably Thin Electronics

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

American Semiconductor designs, manufactures, and integrates ultra-thin electronic chips (technically called flexible integrated circuits – FleX™ IC’s) to enable the flexible hybrid electronics (FHE) while also enabling traditional electronic applications to dramatically reduce product thickness creating smart-labels and smart-structure products. The proprietary Chip Scale Packaging (CSP) technology that makes FleX™ ICs possible is Semiconductor-on-Polymer (SoP). SoP interest and adoption is developing due to SoP’s capability to provide improved reliability for ultra-thin applications.

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